Microwave electronic devices comprising a metal enclosure

Details Microwave electronic devices comprising a metal enclosure Microwave electronic devices comprising a metal enclosure

2005-02-08

2005-02-08

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S665000, C257S692000, C257S104000, C257S780000, C333S247000

Reexamination Certificate

active

06853073

ABSTRACT:
The present invention relates to a microwave electronic device (1) comprising a metal enclosure (2) having a bottom (21) and a lid (23) and containing an electronic circuit board (3) disposed substantially parallel to said bottom and to said lid, said circuit board having:conductive bottom and top grounding layers (41, 42) respectively disposed on bottom and top faces (31, 32) of the circuit board, andperforations (7a) transverse to said faces of the circuit board and delimited by conductive walls (71) for electrically interconnecting said layers (41, 42).At least some of said walls (71) are electrically connected to the lid of the enclosure by conductive grounding members (8a). Each conductive member (8a) has a metal blade covered with a material (13, 13′) for absorbing microwaves.

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Yook J-G et al: “Experimental and Theoretical Study of Parasitic leakage/Resonance in a K/KA-Band MMIC Package” IEEE Transactions on Microwave Theory and Techniques, IEEE Inc. New York, US, vol. 44, No. 12, Part 2, Dec. 1, 1996, pp. 2403-2409, XP000636422.

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