Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1988-11-25
1990-06-12
Edlow, Martin H.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 74, 174 525, 333247, H01L 2316
Patent
active
049337459
ABSTRACT:
A package is provided for a pair of microwave semiconductor devices, such package comprising upper and lower mating covers, each one of such covers having bonded thereto a corresponding one of the pair of microwave semiconductor devices. With such arrangement, after the devices are bonded to the cover to form a component of the package, the effective impedance of the thus formed component is electrically characterized, or measured. Having characterized a large quantity of such components, the components are then sorted into bins with components having substantially matched characteristics being placed in a common one of the bins. Pairs of such components in a common bin are used as the upper and lower cover for the package. Thus, assembly time is significantly reduced since additional matching compensation techniques are not required.
REFERENCES:
patent: 3886505 (1975-05-01), Jacobson
patent: 4211986 (1980-07-01), Tajima
patent: 4575701 (1986-03-01), Greed
Bourque Paul J.
O'Shea Richard L.
Edlow Martin H.
Maloney Denis G.
Monin Donald L.
Raytheon Company
Sharkansky Richard M.
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