Microwave compression interconnect using dielectric filled three

Details Microwave compression interconnect using dielectric filled three Microwave compression interconnect using dielectric filled three

1996-04-16

1997-10-07

Gensler, Paul

Wave transmission lines and networks

Long lines

Shielded type

333260, H01P 300, H01P 500

Patent

active

056753020

ABSTRACT:
A microwave frequency three-wire transmission line provides the capability of solderless interconnections between stacked microwave hybrid and printed wiring board (PWB) assemblies. Three wire-like compressible conductors are embedded in a dielectric support member. Each compressible conductor is realized by densely packing thin wire into an opening in the supporting dielectric. The dielectric preferably has a metal shielding surrounding the outer periphery to suppress higher order modes. A vertical right angle bend transition uses the transmission line to interconnect between grounded coplanar waveguide (GCPW) transmission lines. This orthogonal transition uses button spring contacts, thus creating a reusable solderless vertical interconnection between the two transmission lines. This transition can operate from DC to greater than 15 GHz with good match and low loss, and allows a transition from a GCPW transmission line on a first substrate to another GCPW transmission line on a second substrate stacked above the first substrate.

REFERENCES:
patent: 4556265 (1985-12-01), Cunningham
patent: 4686492 (1987-08-01), Grellmann et al.
patent: 5349317 (1994-09-01), Notani et al.
patent: 5552752 (1996-09-01), Sturdivant et al.
"Array Module Connector Test Program at Unisys," R.J. Kuntz, S. Williams, MCM '94 Proceedings, pp. 498-503 no month.
"CIN::APSE Standard Products," Cinch Connector Division no date.
"A Modified PTFE Microwave Circuit Substrate," R.J. Bonfield, MSN & Communications Technology, Feb. 1988.

Affiliated with

Also associated with

Rating

Microwave compression interconnect using dielectric filled three does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microwave compression interconnect using dielectric filled three, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave compression interconnect using dielectric filled three will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2360567