Microwave component mounting

Details Microwave component mounting Microwave component mounting

1986-01-21

1988-06-28

Nussbaum, Marvin L.

Wave transmission lines and networks

Long line elements and components

Waveguide elements and components

333 17L, 333252, 333260, 174 52FP, H01P 122, H01P 500, H01P 1100

Patent

active

047542438

ABSTRACT:
A method of making a microwave semiconductor component and concurrently forming therewith a mounting membrane adapted for positioning the semiconductor component in an RF transmission medium such as a waveguide. Substantially concurrently with the deposition of a metallic film in connection with forming a semiconductor elements, there is deposited a metallic membrane on the base silicon substrate and outside of the circuit element. The outer periphery of the base substrate is removed to expose the membrane. The metallic membrane is preferably of gold.

REFERENCES:
patent: 3163835 (1964-12-01), Scott
patent: 3721923 (1973-03-01), Gray et al.
patent: 4475007 (1984-10-01), Ohno
patent: 4571559 (1986-02-01), Henry et al.
patent: 4581250 (1986-04-01), Armstrong et al.
Millimeter Wave High Power Solid State Limiter, by Armstrong & Anand, Microwave Journal, vol. 26, Mar. 1983; pp. 65-66, 68, 70, and 72.

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