Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Patent
1979-11-16
1981-09-22
Mullins, James B.
Amplifiers
With semiconductor amplifying device
Including distributed parameter-type coupling
331107C, H03F 360, H03B 714
Patent
active
042912792
ABSTRACT:
A microwave combiner assembly is described incorporating a coaxial transmission line having a plurality of diodes exhibiting negative resistance at high frequency mounted between the center conductor and the outer conductor of the transmission line. Each diode is mounted on a segment forming a portion of the center conductor which are separated by slots containing lossy dielectric. A signal is capacitively coupled from each diode by capacitively coupling each segment to a common center conductor. Each diode is biased by coupling a bias voltage to each segment. The microwave combiner overcomes the problem of mechanically assembling a plurality of diodes in an oscillator or amplifier while attenuating anti-phase currents in the diodes indicative of undesired oscillator modes.
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Mullins James B.
Trepp R. M.
Westinghouse Electric Corp.
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