Microwave circuit interconnect system

Details Microwave circuit interconnect system Microwave circuit interconnect system

1981-07-06

1984-06-19

Gensler, Paul L.

Wave transmission lines and networks

Coupling networks

With impedance matching

333246, 333260, H01P 500

Patent

active

044555377

ABSTRACT:
A plane conductive contact surface on a support member for a first microwave circuit chip is parallel and coextensive with a planar spring finger contact element of a support member for a second microwave circuit chip. The contact surface and contact element are connected to the ground planes of the respective chips. The contact element resiliently engages the conductive contact when the support members are positioned adjacent to one another. The circuit elements on the opposite surface from the ground plane on the two chips are connected to one another by a wire which is centered over the spring finger contact element and the impedance of the connection comprising the wire and spring contact closely matches the impedance of the two microwave circuit chips. The resistance at the connection between the spring finger contact element and the conductive contact surface is low.

REFERENCES:
patent: 3155767 (1964-11-01), Schellack
patent: 3218584 (1965-11-01), Ayer
patent: 3270311 (1966-08-01), Deer et al.
patent: 3775644 (1973-11-01), Cotner et al.
patent: 3792383 (1974-02-01), Knappenberger
patent: 4143342 (1979-03-01), Cain et al.
patent: 4186358 (1980-01-01), Czech et al.
patent: 4208642 (1980-06-01), Saunders
Stuckert, Transmission Line Connector, IBM Technical Disclosure Bulletin, vol. 8, No. 4, Sep. 1965, pp. 518, 519.
Comsat Technical Review, vol. 9, No. 1, Spring 1979, pp. 128-130.

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