Microwave circuit integrating

Details Microwave circuit integrating Microwave circuit integrating

1985-06-03

1990-04-10

James, Andrew J.

357 69, 357 81, H01L 2348, H01L 2944, H01L 2960

Patent

active

049165151

ABSTRACT:
A microwave integrated circuit includes a silicon chip having a pair of diffused junctions. A pair of gold leads 0.3 mils thick are in contact with respective ones of the diffused junctions depending from the chip parallel to the top surface of an alumina substrate 15 mils thick with an adhesive layer of an alumina-filled epoxy at most 0.1 mils thick between the beam leads and the substrate.

REFERENCES:
patent: 3611065 (1971-10-01), Zschauer
patent: 4003073 (1977-01-01), Helda et al.
patent: 4115837 (1978-09-01), Beall et al.
patent: 4376287 (1983-03-01), Sechi
Webster's Ninth New Collegiate Dictionary, 1983, p. 56.

Affiliated with

Also associated with

Rating

Microwave circuit integrating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microwave circuit integrating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave circuit integrating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2302573