Microwave circuit boards and method of manufacture thereof

Details Microwave circuit boards and method of manufacture thereof Microwave circuit boards and method of manufacture thereof

1982-07-12

1985-06-25

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 383, 204 385, 204 42, 339 17B, 427 97, 427 98, C25D 1108, H05K 109

Patent

active

045252475

ABSTRACT:
Circuit boards, useful in microwave frequency applications, are formed from a laminate consisting initially of an insulator sandwiched between a copper foil and an aluminum plate. The boards are provided with through-hole connections by means of a procedure which includes drilling through the board to form through-holes, anodizing all exposed surfaces of the aluminum, electroplating copper over all anodized aluminum surfaces, sodium or plasma etching to alter the surface of the walls of the holes in the insulator to allow them to be "wet", and electroless copper plating the entire board to form a continuous upper coating over the copper foil, the copper plate and the walls of the through-holes.

REFERENCES:
patent: 4293377 (1981-10-01), Miyajima
patent: 4389278 (1983-06-01), Kai

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