Microwave circuit boards

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...

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Details

174 685, 427 96, 428463, 428469, 428422, 428461, B32B 2700

Patent

active

043351808

ABSTRACT:
Microwave circuit boards and methods of making microwave circuit boards, the circuit boards having relatively high dielectric constants, excellent moisture resistance, and reduced tendency to incur changes in dimensions after processing. The method comprises blending in a polymer dispersion, a particulate filler material having a high dielectric constant and microfibrous material to form a slurry of polymer, filler, and fiber. A flocculant is added to the slurry to agglomerate the polymer particles, the filler particles, and the microfibers to produce a dough-like material. The dough-like material is eventually formed into a sheet, and is thereafter dried. A conductive foil such as copper is then applied to both sides of the sheet to provide a microwave circuit board.

REFERENCES:
patent: 3136680 (1964-06-01), Hochberg
patent: 3740678 (1973-06-01), Hill
patent: 3972755 (1976-08-01), Misfeldt
patent: 4076889 (1978-02-01), Sasaki et al.

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