Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge
Reexamination Certificate
2006-10-24
2006-10-24
Phan, Tho (Department: 2821)
Chemistry: electrical and wave energy
Processes and products
Electrostatic field or electrical discharge
C204S167000, C343S872000, C424S449000, C514S327000
Reexamination Certificate
active
07125476
ABSTRACT:
The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.
REFERENCES:
patent: 4911981 (1990-03-01), Schnur et al.
patent: 5049382 (1991-09-01), Price et al.
patent: 5089742 (1992-02-01), Kirkpatrick et al.
patent: 5096551 (1992-03-01), Schoen et al.
patent: 5342737 (1994-08-01), Georger, Jr. et al.
patent: 5650787 (1997-07-01), Lim et al.
patent: 5651976 (1997-07-01), Price et al.
patent: 5814414 (1998-09-01), Georger, Jr. et al.
patent: 6013206 (2000-01-01), Price et al.
patent: 6280759 (2001-08-01), Price et al.
patent: 6452564 (2002-09-01), Schoen et al.
patent: 2003/0099574 (2003-05-01), Bentsen et al.
patent: 2004/0063915 (2004-04-01), Diner et al.
Browning et al, “Fabrication and radio . . . near percolation”, 1998, American Institute of Physics.
Kirk-Othmer Encyclopedia of Chemical Technology, Fourth Edition, vol. 5, A. Wiley-Interscience Publication, John Wiley & Sons, Inc., 1993, pp. 599-728.
Brady, Jr. Robert F.
Chiou Bor-Sen
Dressick Walter J.
Leamann Dana
Mera Ann
Phan Tho
The United States of America as represented by the Secretary of
LandOfFree
Microwave-attenuating composite materials, methods for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microwave-attenuating composite materials, methods for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave-attenuating composite materials, methods for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3716127