Microsystem component and method for gluing microcomponents...

Details Microsystem component and method for gluing microcomponents... Microsystem component and method for gluing microcomponents...

2004-08-06

2010-06-29

Goff, John L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S275100, C156S273100, C156S283000, C156S322000

Reexamination Certificate

active

07744718

ABSTRACT:
A method for gluing microcomponents to a substrate (1) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive (5) to the microcomponent (18) and/or the substrate (1), heating the hot melt type adhesive (5), and placing the microcomponent (18) onto the substrate (1). The hot melt type adhesive (5) is on the contact surfaces between the microcomponent (18) and the substrate (1) during and after gluing.

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Machine Translation of DE 3739333 A1, Jun. 25, 2009.

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