Microstructured arrangement for the bubble-free filling with...

Surgery – Instruments – Heat application

Reexamination Certificate

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Details

C422S050000, C422S051000, C422S067000, C422S063000, C422S064000, C422S066000, C422S068100, C422S075000, C422S082000, C422S091000, C422S105000, C422S105000, C210S097000, C210S100000, C210S104000, C210S189000, C210S321600, C210S634000, C210S658000, C210S787000, C210S806000, C436S043000, C436S044000, C436S045000

Reexamination Certificate

active

07485118

ABSTRACT:
The present invention relates to a microstructure arrangement for the bubble-free filling with a liquid of at least one system for draining off liquids. The arrangement has an inlet for the arrangement to be connected to a system for the supply of liquids and at least one outlet for the arrangement to be connected to the at least one liquid-discharging system. The arrangement has a transition region, through which the liquid can be transported from the inlet to the at least one outlet. At a start of the transition region, at least one first microstructure element for producing a point with increased capillary force is provided, in order to achieve gap-free wetting of the areas bounding this point with increased capillary force, in particular side walls, a cover and/or a bottom.

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patent: 1 201 304 (2002-05-01), None
patent: WO 99/45045 (1999-09-01), None
patent: WO 01/26813 (2001-04-01), None
patent: WO 03/025547 (2003-03-01), None

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