Microstructure, process for manufacturing thereof and devices in

Details Microstructure, process for manufacturing thereof and devices in Microstructure, process for manufacturing thereof and devices in

1995-01-26

1997-08-19

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaged product

Structurally defined

430311, 430320, 310309, G03F 700, H02N 100

Patent

active

056586981

ABSTRACT:
A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1).
The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure.
The microstructure can have application as electrostatic actuator etc., depending on choice of shape and composition.

REFERENCES:
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patent: 5061049 (1991-10-01), Hornbeck
patent: 5221415 (1993-06-01), Albrecht et al.
Cheung, et al. "Modeling and Position--Detection of a Polysilicon Linear Microactuator," Micromechanical Sensors, Actuators and Systems, DSC--vol. 32 (ASME 1991) pp. 269-278.
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Gianchandani, et al. "Micron-Size, High Aspect Ratio Bulk Silicon Micromechanical Devices," Proceedings IEEE Electro Mechanical Workshop 1992, pp. 208-213,
Diem, et al. "SOI (SIMOX) As A Substrate For Surface Micromachining Of Single Crystalline Silicon Sensors and Actuators," The 7th International Conference on Solid-State Sensors and Actuators, LETI/CEA-Technologies Avancees, Grenoble Cedex, (1993) pp. 233-236.
Nonogaki, "Bisaikako & Rejisuto (Fine Processing and Resist)"(1991) pp. 11-12.
J. Zhu, et al., "A Micro Step Motion of Polysilicon Structures on Silicon Substrate", 1993 Japan Int'l Electronics Mfg. Technol. Symposium, Jun. 1993, pp. 85-88.
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