Microstructure cooler and use thereof

Details Microstructure cooler and use thereof Microstructure cooler and use thereof

2005-03-08

2005-03-08

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C174S015100, C174S015200, C165S080400, C165S104260, C257S714000, C257S715000

Reexamination Certificate

active

06865081

ABSTRACT:
The invention relates to a microstructure cooler3for an article4to be cooled, whereby the cooler3includes a stack of at least two metal films1and one base plate5that can be brought via a thermal contact surface6into thermal contact with the article4, the metal films1and the base plate5are joined to one another in a material fit, present in the metal films1are channels2for cooling medium, and the channels2have a width in the range of 100 to 2,000 μm, a depth in the range of 25 to 1,000 μm, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels2in the metal films1are in the range of 50 to 300 μm, and the base plate5has a thickness in the range of 200 to 2,000 μm.

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Chip, Oct. 2002, p. 48.

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