Microstructure and method of making such structure

Details Microstructure and method of making such structure Microstructure and method of making such structure

1993-11-29

1995-03-21

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Temperature

257469, 257419, H01L 2714, H01L 3100

Patent

active

053998979

ABSTRACT:
An integrated circuit having a semiconductor layer having formed therein a electronic circuit. An electrical device, electrically connected to the electronic circuit, has a corrugated platform supported over, displaced from, and integrally formed with, the substrate. In a preferred embodiment the electrical device is a bolometer and the electronic circuit is a read out circuit for the device. The platform includes a surface member and a leg, a proximate end of the leg being disposed on the substrate and the distal end being elevated from the substrate and terminating at the surface member. Preferably the leg and the surface member are corrugated. The supporting surface has a corrugation parallel with the leg. The surface member is supported, as a corrugated air-bridge, over the surface of the substrate by corrugated legs. The temperature sensitive resistive material is formed over the corrugated surface member. Electrical conductors are formed over the legs, one end being in contact with the electrical contacts and the other ends being connected to the portions of the temperature sensitive resistive material adjacent the distal ends of the legs.

REFERENCES:
patent: 3621154 (1971-11-01), Kozen
patent: 5058856 (1991-10-01), Gordon et al.
patent: 5129983 (1992-07-01), Greiff
patent: 5177579 (1993-01-01), Jerman
patent: 5193911 (1993-03-01), Nix et al.
patent: 5298748 (1994-03-01), Kenny et al.

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