Microstrip-to-microstrip RF transition including co-planar...

Details Microstrip-to-microstrip RF transition including co-planar... Microstrip-to-microstrip RF transition including co-planar...

2008-01-01

2008-01-01

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S262000

Reexamination Certificate

active

07315223

ABSTRACT:
A microstrip-to-microstrip RF transition circuit that employs a wide microstrip line transition to a short co-planar waveguide section. In one embodiment, a first microstrip line and a first ground plane are patterned on a top surface of a semiconductor wafer, and a second microstrip line and a second ground plane are patterned on a bottom surface of the wafer. A signal via is formed through the wafer and makes electrical contact with the first and second microstrip lines. Likewise, at least one ground via is formed through the wafer and makes electrical contact with the first and second ground planes. A widened portion of the microstrip line is positioned between extended portions of the respective ground plane so that a slot is provided between the widened portion and the extended portion.

REFERENCES:
patent: 5994983 (1999-11-01), Andersson
patent: 6023211 (2000-02-01), Somei
patent: 6617943 (2003-09-01), Fazelpour
patent: 2004/0119565 (2004-06-01), Shirasaki

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