Microstrip structure having contact pad compensation

Details Microstrip structure having contact pad compensation Microstrip structure having contact pad compensation

1989-09-29

1992-03-03

LaRoche, Eugene R.

Wave transmission lines and networks

Coupling networks

With impedance matching

333246, H01P 500

Patent

active

050936409

ABSTRACT:
A microstrip structure includes a microstrip transmission line having a characteristic impedance, a contact pad for interconnection of the transmission line to an external device, and a compensation line connected between the contact pad and one end of the microstrip transmission line. The contact pad has larger dimensions than the transmission line and thus introduces parasitic capacitance. The compensation line is a narrow line having high impedance and is selected such that its equivalent inductance resonates with the parasitic capacitance at the upper frequency of the range of frequencies over which the transmission line is intended to be operated, thereby matching the contact pad to the transmission line.

REFERENCES:
patent: 3419813 (1968-12-01), Kamnitsis
patent: 3462713 (1969-08-01), Knerr
patent: 3573670 (1971-04-01), Skobern
patent: 4186358 (1980-01-01), Czech et al.
patent: 4673958 (1987-06-01), Bayraktaroglu
patent: 4870375 (1989-09-01), Krueger, Jr. et al.
patent: 4891612 (1990-01-01), Gleason et al.

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