Microstrip line dielectric filter

Details Microstrip line dielectric filter Microstrip line dielectric filter

1996-10-01

1999-05-04

Krynski, William

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428615, 428672, 428675, B32B 300

Patent

active

059003081

ABSTRACT:
In a microstrip line dielectric filter, a principal layer of a conductor constituting a microstrip line circuit consists of a Cu plating layer and the thickness of the conductor is 10 .mu.m or less. In another embodiment, the thickness of the conductor is determined in relation to a center frequency of a wave transmitted through the filter so as to be within the range defined by a hatched area in the graph of FIG. 6.

REFERENCES:
V. S. Aramati et al., "Thin-Film Microwave Integrated Circuits", IEEE Transactions on Parts, Hybrids and Packaging, vol. 12, No. 4, Dec. (1976), pp. 309-316.
M. W. Hosking, "The Realm of Microwaves", Wireless World, vol. 79, No. 14, Jul. (1973), pp. 31-35.
T. H. Oxley et al., "Microwave Integrated Circuit Techniques", G.E.C. Journal of Science and Technology, vol. 43, No. 1, Jan. (1976), pp. 21-331.
H. Sobol., "Applications of Integrated Circuit Technology to Microwave Frequencies", Proc. of the IEEE, vol. 59, No. 8, Aug. (1971), pp. 1200-1211.
T. C. Edwards., "Foundations for Microstrip Circuit Design", John Wiley and Sons, (1981), pp. 28-29.

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