Microstrip balun having improved bandwidth

Wave transmission lines and networks – Coupling networks – Balanced to unbalanced circuits

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Details

333238, H01P 510

Patent

active

047392894

ABSTRACT:
A microstrip balun comprises a ceramic substrate having a ground plane on one surface and three elongated conductive strips on the opposite surface. First ends of the outer strips are interconnected with the ground plane through vias in the substrate. The unbalanced signal input is applied to the ground plane near the vias and one end of the inner strip. The other ends of the outer strips are interconnected, and the balanced signal output is taken at this interconnection and at one end of the inner strip. A portion of the ground plane beneath portions of the strips can be removed.

REFERENCES:
patent: 3093805 (1963-06-01), Osifchin et al.
patent: 3575674 (1971-04-01), Howe, Jr.
patent: 3835421 (1974-09-01), DeBrecht et al.
patent: 3975690 (1976-08-01), Fleming

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