Microsphere of solder having a metallic core and production ther

Details Microsphere of solder having a metallic core and production ther Microsphere of solder having a metallic core and production ther

1975-12-30

1978-06-27

Rosenberg, P. D.

Specialized metallurgical processes, compositions for use therei

Processes

Electrothermic processes

75 05B, 148 24, 264 7, 428570, B22D 2308

Patent

active

040972666

ABSTRACT:
A microsphere of solder having a metallic core, in which the thickness of the solder coating of the microsphere is more than 20 microns, can be produced by a process comprising preparing a sheet having a plurality of hollows provided all over the sheet, placing a spherical grain of a metal together with at least one grain of solder in each of said hollows, the metallic grain having wettability for solder, then heating the grains in the hollow in the presence of a flux to coat the metallic grain with the solder, and recovering a spherical solder bead having a metallic core.

REFERENCES:
patent: 2815729 (1957-12-01), Goodman
patent: 3303393 (1967-02-01), Hymes
patent: 3703254 (1972-11-01), Maierson

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