Microshells for multi-level vacuum cavities

Details Microshells for multi-level vacuum cavities Microshells for multi-level vacuum cavities

2007-03-09

2010-02-09

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE23193

Reexamination Certificate

active

07659150

ABSTRACT:
Microshells for encapsulation of devices such as MEMS and microelectronics. In an embodiment, the microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation as a function of the dimension of the perforation to form cavities having different vacuum levels on the same substrate.

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