Microridge abrasion for selective metalization

Details Microridge abrasion for selective metalization Microridge abrasion for selective metalization

1997-05-20

1998-04-07

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 427355, 427357, B05D 512

Patent

active

057361916

ABSTRACT:
A process for selective metalization for electrically isolating areas of a substrate is disclosed. The process employs placing microridges onto a surface, the microridge protruding from the plane formed by the surface. The surface, including the microridge, is then metalized and a portion of the metalized microridge, beyond the surface plane is removed. This removal process creates electrically isolated areas without affecting the integrity of the substrate.

REFERENCES:
patent: 2962393 (1960-11-01), Ruckelshous
patent: 3601759 (1971-08-01), Barker
patent: 4077695 (1978-03-01), Bakermans
patent: 4406062 (1983-09-01), Navarro
patent: 4749371 (1988-06-01), Hirai et al.
patent: 4875259 (1989-10-01), Appledorn
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5176530 (1993-01-01), Reylek et al.

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