Pumps – Motor driven – Magnetostrictive chamber
Patent
1991-07-02
1993-11-09
Bertsch, Richard A.
Pumps
Motor driven
Magnetostrictive chamber
417413R, F04B 3504
Patent
active
052597377
ABSTRACT:
A micropump for pumping liquid from an entry channel to an exit channel is disclosed. The micropump is formed in a semiconductor substrate sealed by two glass substrates. The micropump includes first and second chambers and flow channel means coupled between the two chambers. The micropump also includes a valve coupled between the entry channel and the first chamber. The valve includes a flexible valve membrane positioned closer to a second side of the semiconductor substrate than to its first side for causing the valve to be or not to be in contact with the second side of the semiconductor substrate for closing or opening the valve on the glass substrate. Additionally, the micropump includes a diaphragm forming part of a flexible wall of the second chamber and positioned closer to the second side of the semiconductor substrate than to its first side. The diaphragm is responsive to external pressure for causing liquid to be pumped from the entry channel to the exit channel. Thus, the height of the valve is reduced, preventing deformation due to strength such as its own weight and may impact due to a dropping. As a result, the valve sealing is improve on the glass substrate. Therefore, the micropump can accurately discharge a small quantity of liquid.
REFERENCES:
patent: 4649886 (1987-03-01), Igashira et al.
patent: 5085562 (1992-02-01), van Lintel
Kamisuki Shinichi
Nose Yasuto
Shimizu Nobuo
Yotsuya Shinichi
Bertsch Richard A.
Freay Charles G.
Seiko Epson Corporation
Tsiang Harold T.
LandOfFree
Micropump with valve structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micropump with valve structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micropump with valve structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1138789