Micropump and adhesive-free method for joining two substrates

Details Micropump and adhesive-free method for joining two substrates Micropump and adhesive-free method for joining two substrates

2004-12-20

2011-10-25

Freay, Charles (Department: 3746)

Pumps

Motor driven

Electric or magnetic motor

C417S413100, C137S855000

Reexamination Certificate

active

08043073

ABSTRACT:
The invention relates to a device provided with channel-type structures for transporting and/or storing a liquid and/or gaseous medium. The device comprises a first (1) substrate layer and a second substrate layer (2), and a functional element (3) that is sandwiched between the first and second substrate layers, the channel-type structures being embodied in the first and/or second substrate layer. The first and second substrate layers are solidly and permanently interconnected, and the functional element is clamped between the first and second substrate layers. The functional element is elastic, the first and second layers are rigid, and the channel-type structures in the first and/or second substrate layers are at least partially sealed in a gas-tight and/or liquid-tight manner due to the functional element.

REFERENCES:
patent: 6644944 (2003-11-01), Karp
patent: 2002/0155010 (2002-10-01), Karp et al.
patent: 2002/0168278 (2002-11-01), Jeon et al.

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