Microprocessor layout minimizing temperature and current effects

Details Microprocessor layout minimizing temperature and current effects Microprocessor layout minimizing temperature and current effects

1988-10-31

1990-05-08

Hudspeth, David

Electrical transmission or interconnection systems

Nonlinear reactor systems

Parametrons

3073032, 307310, 364184, H03K 1712

Patent

active

049241117

ABSTRACT:
An integrated circuit having a microprocessor core interfaced to large power transistors is described. This integrated circuit provides the capability to intelligently control and drive loads requiring currents exceeding 250 milli amps. The large power transistors are built in a technology compatible with the microprocessor core technology resulting in a more readily manufacturable circuit. The microprocessor core is layed out in a manner which provides the greatest distance between the most heat sensitive microprocessor core circuits and the power devices. On chip temperature sensing and feedback is provided for junction temperature monitoring and control.

REFERENCES:
patent: 3777240 (1973-12-01), Neill
patent: 4288854 (1981-09-01), Burroughs
patent: 4453094 (1984-06-01), Peil et al.
patent: 4547826 (1985-10-01), Premerlani
patent: 4607962 (1986-08-01), Nagao et al.
patent: 4771845 (1988-09-01), Shimizu
patent: 4789040 (1988-12-01), Morishita et al.
patent: 4791380 (1988-12-01), Chiappetta

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