Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-03-19
1993-12-21
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165185, 174 163, 257707, 257727, H05K 720
Patent
active
052725995
ABSTRACT:
Operating heat from a computer microprocessor chip mounted on the top side of a printed circuit board is removed therefrom using a heat dissipation assembly including a metal heat transfer plate and a metal heat conductor block. The heat transfer plate is secured to the circuit board and has a first section which underlies the circuit board beneath the microprocessor chip, and a second portion projecting outwardly from an edge of the circuit board and secured to a wall of the metal housing cage of the computer. The metal heat conductor block extends through a complementarily configured opening formed in the circuit board beneath a central portion of the metal underside section of the chip. A top end of the block is bonded to the metal underside of the chip using heat conductive cement, and the bottom end of the block is removably secured to the top side of the first plate portion beneath the printed circuit board by a threaded fastener, a layer of heat conductive grease preferably being disposed between the bottom block end and the first plate portion. Operating heat from the chip is conducted downwardly through the metal block to the heat transfer plate and then through the plate to the metal chassis which serves as a large heat sink. Additionally, heat is dissipated from the plate by convection. This convective heat dissipation is preferably enhanced by securing a cooling fin structure to the second plate portion.
REFERENCES:
patent: 4725920 (1988-02-01), Ijichi et al.
patent: 4756081 (1988-07-01), Penn
patent: 4916575 (1990-04-01), Van Asten
patent: 5162974 (1992-11-01), Currie
PCT/US91/03839 "Heat Sink for Heat Generating Components" Dec. 1991.
Compaq Computer Corporation
Thompson Gregory D.
LandOfFree
Microprocessor heat dissipation apparatus for a printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microprocessor heat dissipation apparatus for a printed circuit , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microprocessor heat dissipation apparatus for a printed circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-312780