Microprocessor cooling in a portable computer

Details Microprocessor cooling in a portable computer Microprocessor cooling in a portable computer

1993-09-02

1995-07-04

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361680, 361711, 361719, 622592, G06F 116, H05K 720

Patent

active

054306094

ABSTRACT:
A CPU IC package for a computer system is cooled by a layer of compressible, heat-conducting material compressed between the IC package and a heat sink plate. In one embodiment the heat sink plate is a wall element of an access panel providing access to the interior of the computer system. Closing the access panel compresses the heat-conducting material between the IC package and the heat sink plate. To provide mechanical stability, the heat-conducting material is fastened to one of the heat sink plate and the IC package. In alternative embodiments the plate may be mounted outside the enclosure of the system with the heat-conducting material extending through an opening in a wall of the enclosure.

REFERENCES:
patent: 4316236 (1982-02-01), Lechner et al.
patent: 4997032 (1991-03-01), Danielson et al.
patent: 5237486 (1993-08-01), LaPointe et al.
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5316491 (1994-05-01), Satou et al.
patent: 5331506 (1994-07-01), Nakajima
patent: 5355357 (1994-10-01), Yamamori et al.
patent: 5383340 (1995-01-01), Larson et al.

Affiliated with

Also associated with

Rating

Microprocessor cooling in a portable computer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microprocessor cooling in a portable computer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microprocessor cooling in a portable computer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-765050