Microprobe provided circuit substrate and method for producing t

Details Microprobe provided circuit substrate and method for producing t Microprobe provided circuit substrate and method for producing t

1990-11-29

1992-11-03

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428432, 428426, 428457, B32B 900

Patent

active

051607794

ABSTRACT:
A probe assembly for testing semiconductor wafer chips includes microprobes embedded in a circuit substrate. The microprobes are pillar-shaped conductors formed in through holes in a base of the substrate. One end of the microprobe is flush with the base surface contacts and is electrically connected through a reinforcing substrate to a probe assembly test head which generates various test signals. The other end of the pillar-shaped microprobes projects beyond the base to make contact with and deliver test signals to various electrodes of a chip to be tested.

REFERENCES:
patent: 3827891 (1974-08-01), Larry
patent: 4563640 (1986-01-01), Hasegawa

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