Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
1999-08-23
2001-12-11
Jones, Deborah (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S674000, C427S098300, C427S443100, C106S001230, C106S001260
Reexamination Certificate
active
06329072
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a microporous metal copper film, and more particularly, to a metal copper film having a vast number of micropores of a micron unit and to an electroless copper plating solution capable of obtaining this copper film. The present invention also relates to a plating product provided with this metal copper film.
BACKGROUND ART
A multi-layer printed circuit board is conventionally manufactured by first preparing a copper clad laminate for the inner layer by processing a copper foil on the copper clad laminate to form a printed circuit; then subjecting the above copper foil to a surface roughening treatment (generally comprising degreasing, followed by a soft etching process as exemplified by treatment with ammonium persulfate, sodium persulfate, cupric chloride, sulfuric acid-hydrogen peroxide system and the like, as well as an activating treatment); subsequently building an acicular film of copper oxide or cuprous oxide on top of the foil by a process such as blackening or browning; and bonding a copper clad laminate for the outer layer or copper foils in multiple layers with a material impregnated with a thermosetting resin (i.e. a “prepreg”) to fabricate a multi-layer laminated board having a high adhesion strength.
Since electric continuity has to be established to each layer of the multi-layer laminated board manufactured in the above process, a through-hole plating on holes drilled through the board is required. However, the conventional method has had a drawback whereby penetration of the acid solution used in the catalyst treatment process for plating through-holes or penetration of the plating solution in the electroless copper plating process tends to dissolve the film made from copper oxide or cuprous oxide, thereby causing a phenomenon called “pink ring”(i.e. “haloing”).
On the other hand, there is an alternative method in which a printed circuit is formed on a copper clad laminate using a copper foil that is pre-processed by surface roughening to eliminate the need for surface roughening as well as the oxide film forming processes required in the method described above, thereby providing a multi-layer printed circuit board. This method, however, has shortcomings such as inferior pattern resolution for the printed etching resist or the etching resist for ultra-violet exposure, which are associated with the surface roughness of the copper foil.
In order to correct the above shortcomings, the present inventors have recently developed a method for forming a uniform and acicular copper film with excellent adhesion strength using electroless copper plating (Japanese Patent Application Laid-Open No. 116176/1992 and International Patent Application No. PCT/JP96/03829). This technology enabled manufacturing of a copper clad laminate having a copper film with a high adhesion strength, without the aforementioned shortcomings.
DISCLOSURE OF THE INVENTION
While earnestly making research efforts to improve on the technology described above, the present inventors have discovered the fact that, rather than a uniform and acicular copper film, a microporous copper film can be produced depending on the surfactant used, thereby providing a copper clad laminate having a copper film with high adhesion strength.
Such a microporous copper film is not yet known at present. The present inventors have further found that not only this microporous copper film can be utilized for the copper clad laminate but also this film itself can be used as a metal filter or a catalyst or its carrier. These findings have led to the completion of the present invention.
Accordingly, it is an object of the present invention to provide a metal copper film having one hundred thousand to one billion micropores per one square centimeter.
Another object of the present invention is to provide an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating the reductive reaction, characterized by further comprising a compound containing an acetylenic bond.
Yet another object of the present invention is to provide a plating product having a microporous copper film produced by dipping a plating object into the above electroless copper plating solution.
REFERENCES:
patent: 4563217 (1986-01-01), Kikuchi et al.
patent: 4684550 (1987-08-01), Milius et al.
patent: 0 248 522 (1987-12-01), None
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patent: 1-16176 (1992-04-01), None
patent: 6-306768 (1994-11-01), None
patent: 8-243365 (1996-09-01), None
Ebina Nobuo
Fujinami Tomoyuki
Honma Hideo
Honma Nideo
Jones Deborah
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Young Bryant
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