Microphone packaging scheme

Details Microphone packaging scheme Microphone packaging scheme

1994-02-25

1995-08-15

Kuntz, Curtis

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

Thermal response to, or generation of, sound vibration

381169, 379431, H04R 2500

Patent

active

054427134

ABSTRACT:
A packaging scheme (10) for a microphone (22) comprises a housing having first opening (50) and a second opening (52) at opposing ends of the housing. The microphone has a top portion and a bottom portion arranged within the housing wherein the top portion is exposed to the first opening and the bottom portion is exposed to the second opening. Finally, a porous membrane (20) is mounted between the microphone and the openings on the opposing ends of the housing. The porous membrane can be retained against the housing using a sticker (16).

REFERENCES:
patent: 3548121 (1970-12-01), Gorike
patent: 3947646 (1976-03-01), Saito
patent: 4232205 (1980-11-01), Ribeyre
patent: 4463222 (1984-07-01), Poradowski
patent: 4847818 (1989-07-01), Olsen
patent: 4850016 (1989-07-01), Groves et al.
patent: 4926474 (1990-05-01), Marks
patent: 5204907 (1993-04-01), Staple et al.
patent: 5263093 (1993-11-01), Nakamura et al.

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