Microphone manufacturing method

Details Microphone manufacturing method Microphone manufacturing method

2007-02-23

2010-12-14

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S609100, C216S052000, C381S358000

Reexamination Certificate

active

07849583

ABSTRACT:
A microphone manufacturing method that includes forming an etching protective film on a surface of a semiconductor substrate, opening an etching window through the etching protective film, and forming a sacrifice layer in the etching window and also on an upper face of the etching protective film. The method includes forming a vibration film above said sacrifice layer and starting an etching process of said sacrifice layer through a preformed port at a location wherein said sacrifice layer is sandwiched by said vibration film and the etching protective film and located apart from the etching window. The etching process uses an etchant to which the etching protective film is resistant, to open the etching window. The method includes crystal anisotropically etching said semiconductor substrate through the port and the etching window by using an etchant to which the etching protective film is resistant so that a cavity is formed.

REFERENCES:
patent: 5452268 (1995-09-01), Bernstein
patent: 7080442 (2006-07-01), Kawamura et al.
patent: 7204009 (2007-04-01), Kawamura et al.
patent: 7434305 (2008-10-01), Minervini
patent: 62-76784 (1987-04-01), None
Patent Abstracts of Japan JP62076784 dated Apr. 8, 1987 (1 page).
Patent Abstracts of Japan JP2004-506394 dated Feb. 26, 2004 (English version 11 pages, Japanese version 10 pages) (21 pages total).

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