Micronized wafer

Details Micronized wafer Micronized wafer

1976-01-13

1979-05-08

Penland, R. B.

Food or edible material: processes, compositions, and products

Product with added vitamin or derivative thereof for...

426242, 426629, 426630, 426807, 426450, A23L 224, A23K 100

Patent

active

041537335

ABSTRACT:
Seeds from grain are prepared for animal or human consumption by first heating with infrared radiation until soft, turgid, malleable and plastic. Then the seed are extruded by a roll to form a wafer from each seed, which wafer is suitable for storage and is readily digestible.

REFERENCES:
patent: 3141777 (1964-07-01), Guidarelli
patent: 3471298 (1969-10-01), Hirahara
patent: 3512990 (1970-05-01), Slaybaugh

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