Micromodular electronic package

Details Micromodular electronic package Micromodular electronic package

1977-11-25

1980-09-09

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

339 17CF, 361401, H05K 720

Patent

active

042220904

ABSTRACT:
A micromodular electronic circuit package is disclosed herein constituting a discrete electronic component of sandwich construction having reduced physical density which, in one form, comprises an insulating panel supporting a pair of spaced-apart metal connectors, the opposite side of which supports an insulative stiffener. The stiffener is provided with a cavity centrally located so as to receive and hold a discrete component unit such as a thin film or chip capacitor, resistor or the like. The chip is provided with connection ends that respectively engage with the pair of metal connectors supported on the insulative panel so that mechanical and electrical interconnection is produced. In another form, the component package includes a heat sink slideably engageable over the electronic package for effecting the dissipation of heat during circuit operation.

REFERENCES:
patent: 3335327 (1967-08-01), Damon
patent: 3621338 (1971-11-01), Rogers
patent: 3825876 (1974-07-01), Damon
patent: 3942854 (1976-03-01), Klein
patent: 3963315 (1976-06-01), Bonis
patent: 4012769 (1977-03-01), Edwards

Affiliated with

Also associated with

Rating

Micromodular electronic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromodular electronic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromodular electronic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2226984