Micromirror for a hybrid optoelectronic integrated circuit, a me

Details Micromirror for a hybrid optoelectronic integrated circuit, a me Micromirror for a hybrid optoelectronic integrated circuit, a me

1997-12-03

1999-10-26

Powell, William

Etching a substrate: processes

Forming or treating optical article

216 2, 438 69, 438735, 385 14, H01L 2100

Patent

active

059722320

ABSTRACT:
Disclosed is a micromirror for a hybrid optoelectronic integrated circuit, a method for manufacturing the same, a micromirror-photodetector assembly and an assembly of hybrid optoelectronic integrated circuit for receiving light. The micromirror the present invention comprises a silicon substrate and at least one V-shaped groove formed in the silicon substrate and the V-shaped groove has an inclined surface reflecting light emitted from an optical waveguide to a photodetector. The alignment of the photodetector and the optical fibers is achieved without an additional attachment equipment, by inserting the optical fibers into the V-groove.

REFERENCES:
patent: 4735677 (1988-04-01), Kawachi et al.
Sam Baeza et al., "Universal angle V-block work holding fixture", Issued Aug. 8, 1989, Filed May 20, 1988, Serial No. 196504, Patent Server: 4854568 Detailed View.
David Armitage, "Micromirror spatial light modulator", Issued Oct. 6, 1987, Filed Oct. 9, 1985, Serial No. 785691, Patent Server: 4698602 Detailed View.
Wijayanand Vusirikala et al., "Packaging of a monolithic microwave/optical receiver chip with an optical fiber", CtuW7, 222/CLEO '96/Tuesday Afternoon.
K.P. Jackson et al., "A High-Density,Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology", Journal of Lightwave Technology, vol. 12, No. 7, Jul. 1994, IEEE, pp. 1185-1191.
O. Solgaard et al. "Optoelectronic Packaging Using Silicon Surface-Micromachined Alignment Mirrors", Photonics Technology Letters, vol. 7, No. 1, Jan. 1995, IEEE, pp. 41-43.

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