Micromechanical semiconductor components and manufacturing metho

Details Micromechanical semiconductor components and manufacturing metho Micromechanical semiconductor components and manufacturing metho

1997-09-23

1998-11-10

Picardat, Kevin

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

438 52, H01L 2100

Patent

active

058343326

ABSTRACT:
A component having a movable micro mechanical function element arranged in a cavity having a cover layer supported by webs or pillar-like supports is provided. The movable element is potentially covered with a termination layer for closing the etching holes present in the cover layer. Electrical terminals of the movable part, the cover layer and doped regions produced in the substrate as a cooperating electrode enable the realization of an acceleration sensor that is easy to mount in a housing.

REFERENCES:
patent: 5130276 (1992-07-01), Adams et al.
patent: 5164328 (1992-11-01), Dunn
patent: 5258097 (1993-11-01), Mastrangelo
patent: 5324683 (1994-06-01), Fitch et al.
patent: 5326726 (1994-07-01), Tsang et al.
patent: 5616523 (1997-04-01), Benz et al.
patent: 5656512 (1997-08-01), Beltman
W. Kuehnel et al., "A Surface Micromachined Silicon Accelerometer with On-Chip Detection Circuitry", 8253a Sensors and Actuators--A Physical, A4 (1994) Oct., No. 1, Lausanne, CH, pp. 7-16.
B. Puers et al., "Extremely Miniaturized Capacitive Movement Sensors Using New Suspension Systems", 8253a Sensors and Actuators--A Physical, A41 (1994) Apr. 1, Nos. 1/3, Lausanne, CH pp. 129-135.

Affiliated with

Also associated with

Rating

Micromechanical semiconductor components and manufacturing metho does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromechanical semiconductor components and manufacturing metho, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromechanical semiconductor components and manufacturing metho will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1516083