Micromechanical positional state sensing apparatus method...

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters

Reexamination Certificate

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C324S415000, C324S727000

Reexamination Certificate

active

07616013

ABSTRACT:
A micromechanical device may include one or more piezoresistive elements whose electrical resistance changes in response to externally or internally induced strain. The present invention leverages the piezoresistive properties of such devices to sense the positional state of the device. A sensing circuit may be integrated into the device that senses an electrical resistance of at least a portion of the micromechanical device and provides information regarding the positional state of the micromechanical device. The micromechanical device may be a compliant device that includes relatively flexible members such as mechanical beams or ribbons. The positional states may be continuous positional states (such as the position of an actuator) or discreet positional states (such as the positional state of a bistable memory device). In certain embodiments, the micromechanical device is a threshold detector that latches to a particular stable configuration when an applied force exceeds a selected value.

REFERENCES:
patent: 5355712 (1994-10-01), Petersen et al.
patent: 5445006 (1995-08-01), Allen et al.
patent: 5489774 (1996-02-01), Akamine et al.
patent: 5726480 (1998-03-01), Pister
patent: 6199874 (2001-03-01), Galvin et al.
patent: 6327909 (2001-12-01), Hung et al.
patent: 6969996 (2005-11-01), Staple et al.
patent: 7170141 (2007-01-01), Kornegay et al.
patent: 2005/0150280 (2005-07-01), Tang et al.
Howell, Larry L., Compliant Mechanisms, John Wiley & Sons, Inc., 2001, p. 355-369.
Hwang, Eun-Soo et al. “Flexible polysilicon strain gauge array” Jpn. J. Appl. Phys. vol. 42, 2003, pt. 2, No. 7B, p. L810-813.
Messenger, R.K., McLain, T.W., Howell, L.L., “Improved Nanopositioning Resolution through Piezoresistive Feedback Control of a MEMS Thermal Actuator,” submitted for publication in theProceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE2005-81209.
Messenger, R.K., McLain, T.W., Howell, L.L., “Feedback Control Using Piezoresistive Micro-Displacement Sensing,”Proceeding of IMECE 2004, IMECE2004-59810.

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