Micromechanical electric shunt and encoding devices made therefr

Electricity: circuit makers and breakers – Electrostrictive or electrostatic

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H01H 5700

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active

049595156

ABSTRACT:
A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel process station or post identification or signature encoding apparatus for use on a telecommunications bus or the equivalent. Such identification of signature encoding apparatus may be configured for conventional binary coding. Both frequency and current derivative mode apparatus are disclosed.

REFERENCES:
patent: 3620932 (1971-11-01), Crishal et al.
patent: 3796976 (1974-03-01), Heng et al.
patent: 4674180 (1987-06-01), Zavracky et al.
Petersen, K. E., Micromechanical Membrane Switches on Silicon, Jul. 1979, IBM J. Res. Develop., vol. 23, No. 4, pp. 376-385.
Kurt Petersen: "Micromechanical Voltage-Controlled Switches and Circuits," (probably published in 1978); IBM Corporation Research Div., San Jose, Calif. 95193. Discloses metal covered SiO.sub.2 membrane switches.
J. B. Angell, S. C. Terry, P. W. Barth: "Silicon Micromechanical Devices," Scientific American, vol. 248, Apr. 1983; pp. 44-55. This reference illustrates, among others, capacitive accelerometers of cantilevered SiO.sub.2 beams.
K. E. Petersen: "Silicon as a Mechanical Material," Proc. IEEE, vol. 70, No. 5, May 1982, pp. 420-457. Similar to K. E. Petersen, Micromechanical Switches cited by the Examiner in Paper 9.
P. W. Barth: "Silicon Sensors Meet Integrated Circuits," Chemtech, Nov. 1982, pp. 666-673. Teaches manufacture of SiO.sub.2 cantilevers at page 671.
Kurt E. Petersen: "Dynamic Micromechanics on Silicon: Techniques and Devices," IEEE Trans. on Electron Devices, vol. ED-25, No. 10, Oct. 1978. Another article by Petersen, this reference shows again how to make SiO.sub.2 membrane devices.

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