Micromechanical device for infrared sensing

Details Micromechanical device for infrared sensing Micromechanical device for infrared sensing

2008-02-27

2010-11-02

Porta, David P (Department: 2884)

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

Reexamination Certificate

active

07825381

ABSTRACT:
A micromechanical device including an improved sensing element and improved bending elements is described. Sensing elements include multi-layered structures which are thinner, lighter, and flatter than structures presently known within the related arts. Bending elements include structures which separately respond to illumination by an infrared source so as to twist a sensing element. Micromechanical pixels may be arranged to form two-dimensional arrays of infrared sensitive pixels. Arrays of micromechanical pixels are applicable to imaging devices for use within the fields of security and surveillance, firefighting, automotive safety, and industrial monitoring.

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