Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive
Reexamination Certificate
2006-12-26
2006-12-26
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Thermally responsive
C438S064000, C438S456000, C257SE21613
Reexamination Certificate
active
07153718
ABSTRACT:
A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 μm, which may in particular be in the range of 300 nm to 50 μm.
REFERENCES:
patent: 5164338 (1992-11-01), Graeger et al.
patent: 5312296 (1994-05-01), Aalto et al.
patent: 5343064 (1994-08-01), Spangler et al.
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 5595939 (1997-01-01), Otake et al.
patent: 5852320 (1998-12-01), Ichihashi
patent: 6077721 (2000-06-01), Fukada et al.
patent: 6201284 (2001-03-01), Hirata et al.
patent: 6232150 (2001-05-01), Lin et al.
patent: 6407437 (2002-06-01), Burger
patent: 6433390 (2002-08-01), Hara
patent: 6663789 (2003-12-01), Hara
patent: 6683358 (2004-01-01), Ishida
patent: 39 14 015 (1990-10-01), None
patent: 40 06 108 (1991-08-01), None
patent: 4006108 (1991-08-01), None
patent: 195 37 814 (1997-04-01), None
patent: 196 43 893 (1998-05-01), None
patent: 198 30 158 (1999-04-01), None
patent: 0 557 219 (1998-05-01), None
patent: 2763745 (1998-11-01), None
L. B. Wilner, “A High Performance, Variable, Capacitance Accelerometer”, IEEE Transactions On Instrumentation and Measurement, IEEE Inc., NY, US, Bd. 37, Nr. 4, Dec. 1, 1988, pp. 569-571.
J. Brosnihan et al. “Embedded Interconnect And Electrical Instruments”, 1997 International Conference On Solid-state Sensors and Actuators, Digest of Technical papers, Transducers 97, Chicago, IL, Jun. 16-19, 1997, Sessions 1A1.01-2D3.14.
A. Shaw et al. “SCREAM 1: A single mark, single-crystal silicon process for microelectromechanical structures”, Proceedings of the Workshop on Micro Electro Mechanical Systems (MEMS) Fort Lauderdale, Feb. 7-10, 1993, New York, IEEE, Bd. Workshop Feb. 6, 1993, pp. 155-160.
Fischer Frank
Graf Eckhard
Hein Peter
Bosch GmbH
Ghyka Alexander
Kenyon & Kenyon LLP
LandOfFree
Micromechanical component as well as a method for producing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micromechanical component as well as a method for producing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromechanical component as well as a method for producing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3696622