Micromechanical component

Details Micromechanical component Micromechanical component

1999-04-16

2001-08-14

Chapman, John E. (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514380

Reexamination Certificate

active

06272926

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a micromechanical component.
BACKGROUND INFORMATION
Micromechanical components, in particular acceleration sensors, are known in which a seismic mass is suspended on a substrate by spring elements. As a result of an acceleration parallel to the surface of the substrate, a deflection of the mass can be caused which is measured using an appropriate measuring method. In this context, it is also known to limit the deflection of the mass by a limit stop.
SUMMARY OF THE INVENTION
In contrast, the micromechanical component according to the present invention has the advantage that impermissibly large deflections of the spring elements themselves are avoided. This is advantageous above all in sensors for acceleration, whose spring elements have only slight rigidity. As a result of the substrate limit stops, a planar contact of the mass and the substrate is avoided. Through multiply-folded spring elements, it is possible to realize very flexible spring elements, which can nevertheless be designed to be very resistant to breakage as a consequence of the corresponding bars.
It is particularly advantageous to use a conductive layer on the substrate, since in this way all the limit stops can be set at the same potential as the mass. The conductive layers can also be employed in forming substrate limit stops. As a material for the substrate, the spring elements, and the mass, silicon is particularly suitable.


REFERENCES:
patent: 5777226 (1998-07-01), Ip
patent: 5817942 (1998-10-01), Greiff
patent: 5880369 (1999-03-01), Samuels et al.
patent: 6065341 (2000-05-01), Ishio et al.

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