Micromagnetic latching switch packaging

Details Micromagnetic latching switch packaging Micromagnetic latching switch packaging

2005-05-17

2005-05-17

Donovan, Lincoln (Department: 2832)

Electricity: magnetically operated switches, magnets, and electr

Electromagnetically actuated switches

Polarity-responsive

C200S181000

Reexamination Certificate

active

06894592

ABSTRACT:
Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever. An electromagnet is attached to the inner surface or an outer surface of the cap.

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