Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2005-10-25
2005-10-25
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S118000, C438S050000
Reexamination Certificate
active
06958255
ABSTRACT:
There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This permits handling for fusions bonding. The sacrificial material is then removed to leave the membrane. Membranes of silicon, silicon nitride, etc. can be formed on the sacrificial material. Also described are cMUTs, pMUTs and mMUTs.
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Ergun Arif S.
Huang Yongli
Khuri-Yakub Butrus T.
Le Thao P.
The Board of Trustees of the Leland Stanford Junior University
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