Micromachined device with enhanced dimensional control

Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

7351416, 361280, 3612833, G01P 15125

Patent

active

058803696

ABSTRACT:
A micromachined device is provided that establishes select dimensional relationships between micromachined structures to achieve correlation in dimensional variation among these structures. Such dimensional relationships are achieved through consistent spacing between desired operating structures and by adding new structures (i.e., dimensional control structures) which provide additional consistent spacing at desired locations within the micromachined device.

REFERENCES:
patent: 5286944 (1994-02-01), Li
patent: 5345824 (1994-09-01), Sherman et al.
patent: 5364497 (1994-11-01), Chau et al.
patent: 5447067 (1995-09-01), Biebl et al.
patent: 5447068 (1995-09-01), Tang
patent: 5495761 (1996-03-01), Diem et al.
patent: 5511420 (1996-04-01), Zhao et al.
patent: 5542295 (1996-08-01), Howe et al.
patent: 5563343 (1996-10-01), Shaw et al.
patent: 5565625 (1996-10-01), Howe et al.
patent: 5574222 (1996-11-01), Offenberg
patent: 5618989 (1997-04-01), Marek
patent: 5635638 (1997-06-01), Geen
patent: 5646347 (1997-07-01), Weiblen et al.
Offerens, H. L. et al., "Methods for the Fabrication of Convex Corners in Anisotropic Etching of (100) Silicon in Aqueous KOH," Sensors and Actuators--A Physical, vol. A25, No. 1/03, Oct. 1, 1990.
Ohwada, K. et al., "Groove Depth Uniformization in (110) Si Anisotropic Etching by Ultrasonic Wave and Application to Accelerometer Fabrication," Proceedings of the Workshop on Micro Electrical Mechanical Systems (MEMS), Amsterdam, Jan. 29-Feb. 2, 1995, Institute of Electrical and Electronics Engineers, pp. 100-105.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Micromachined device with enhanced dimensional control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromachined device with enhanced dimensional control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromachined device with enhanced dimensional control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1323058

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.