Micromachined device packaged to reduce stiction

Details Micromachined device packaged to reduce stiction Micromachined device packaged to reduce stiction

1996-03-15

1997-12-09

Johnson, Linda

Package making

Methods

With contents treating

53471, 53432, B65B 5518

Patent

active

056947402

ABSTRACT:
A micromachined device is packaged to reduce stiction. In one embodiment, a level of moisture is introduced in the package to create a very thin film over surfaces of the device. The device can also be packaged with a vapor deposition of an organic material after a wafer of devices has been separated into individual dies and the individual dies are placed in open containers. In another embodiment, a micromachined device is positioned in an open package and a liquid or solid organic material is disposed within the package so that when the device is sealed, the organic material vaporizes and coats portions of the die to reduce stiction.

REFERENCES:
patent: 4189896 (1980-02-01), Kolbach et al.
patent: 5239806 (1993-08-01), Maslakow
patent: 5457939 (1995-10-01), Bardou et al.

Affiliated with

Also associated with

Rating

Micromachined device packaged to reduce stiction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromachined device packaged to reduce stiction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromachined device packaged to reduce stiction will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1598964