Micromachined device having electrically isolated components...

Details Micromachined device having electrically isolated components... Micromachined device having electrically isolated components...

2006-10-03

2006-10-03

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S542000, C438S548000

Reexamination Certificate

active

07115437

ABSTRACT:
A micromachined structure having electrically isolated components is formed by thermomigrating a dopant through a substrate to form a doped region within the substrate. The doped region separates two portions of the substrate. The dopant is selected such that the doped region electrically isolates the two portions of the substrate from each other via junction isolation.

REFERENCES:
patent: 4173496 (1979-11-01), Chiang et al.
patent: 4625561 (1986-12-01), Mikkor
patent: 5480811 (1996-01-01), Chiang et al.
patent: 6544811 (2003-04-01), Allen et al.
patent: 6563227 (2003-05-01), Strnad
“Zone Melting” 2nd Ed., by William G. Pfann, Metallurgical Research Laboratory Bell Telephone Labortories © 1958, 1966 by John Wiley & Sons, Inc.; Library of Congress Catalog Card 65-27655, pp. 254-268.
“Thermomigration of aluminum-rich liquid wires through silicon” by H.E. Cline and T.R. Anthony, Journal of Applied Physics, vol. 47, No. 6, Jun. 1976, pp. 2332-2336.
“Thermomigration Processing of Isolation Grids in Power Structures”, by Thomas R. Anthony; John K. Boah; Mike F. Chang and Harvey E. Cline, IEEE Trans. on Electron Devices, vol. ED-23, No. 8, Aug. 1976, pp. 818-822.
“A silicon-Based, Three-Dimensional Neural Interface: Manufacturing Processes for an Intracortical Electrode Array”, by Patrick K. Campbell; Kelley E. Jones; Robert J. Huber; Kenneth W. Horch, and Richard A. Normann, IEEE, Biomedical Engineering, vol. 38, No. 8, Aug. 1991, pp. 758-767.
“ISAAC—Integrated Silicon Automotive Accelerometer” by Leland “Chip” Spangler and Christopher J. Kemp (Jun. 25-29, 1995) pp. 585-588.
“SCREAM MicroElectroMechnical Systems” by Noel C. McDonald, (1996), p. 49-73.
“Bulk micromachined silicon comb-drive electrostatic actuators with diode isolation” by R.R.A. Syms; B.M. Hardcastle; R.A. Lawes; Sensors and Actuators A 63 (1997) pp. 61-67.
“Deep Diffusions and Soi Layers Produced by Rapid Thermal Processing for Smart Power Applications”, by J.M. Dilhav, L. Corniber, C. Ganibal; Mat. Res. Soc. Symp. Proc. vol. 470 (1997) pp. 319-324.
“Embedded Interconnect and Electrical Isolation for High-Aspect-Ration, SOI Inertial Instruments” by Timothy J. Brosnihan, James M. Bustillo, Albert P. Pisano, and Roger T. Howe (Jun. 16-19, 1997), pp. 637-640.
U.S. Appl. No. 10/371,899, entitled “Micromachined Device Having Electrically Isolated Components and a Method for Making the Same,” and filed on Feb. 20, 2003.

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