Micromachine device processing method

Details Micromachine device processing method Micromachine device processing method

2008-10-09

2010-10-19

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S107000, C438S118000, C438S123000, C438S110000, C438S464000, C438S466000, C438S462000, C257SE21001, C257SE21237

Reexamination Certificate

active

07816184

ABSTRACT:
A micromachine device processing method for dividing a functional wafer, which has micromachine devices formed in a plurality of regions demarcated by streets formed in a lattice pattern on a face of the functional wafer, along the streets into the individual micromachine devices, each micromachine device having a moving portion and an electrode, comprising: a cap wafer groove forming step of forming dividing grooves, which have a depth corresponding to a finished thickness of a cap wafer for protecting the face of the functional wafer, along regions in one surface of the cap wafer which correspond to areas of the electrodes of the micromachine devices; a cap wafer joining step of joining the one surface of the cap wafer subjected to the cap wafer groove forming step to the face of the functional wafer at peripheries of the moving portions; a cap wafer grinding step of grinding the other surface of the cap wafer joined to the face of the functional wafer to expose the dividing grooves to the outside; and a cutting step of cutting the functional wafer and the cap wafer subjected to the cap wafer grinding step along the streets.

REFERENCES:
patent: 6171873 (2001-01-01), Mendelson et al.
patent: 7129110 (2006-10-01), Shibata
patent: 2002/0068373 (2002-06-01), Lo et al.
patent: 2005/0042844 (2005-02-01), Yee
patent: 2005/0070074 (2005-03-01), Priewasser
patent: 2005/0139940 (2005-06-01), Patel et al.
patent: 2008/0061598 (2008-03-01), Reiman et al.
patent: 2008/0164573 (2008-07-01), Basker et al.
patent: 2009/0061598 (2009-03-01), Tsai et al.
patent: 2006-196588 (2006-07-01), None
English Language Abstract of JP 2006-196588.

Affiliated with

Also associated with

Rating

Micromachine device processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromachine device processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromachine device processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4187159