Microfins for cooling an ultramobile device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080200, C165S185000, C257S722000, C361S704000, C361S715000

Reexamination Certificate

active

08054629

ABSTRACT:
The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

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Kurabayashi, K (1998) “Thermal Transport Properties of Organic Films for Advanced VLSI Systems (Doctoral Dissertation)”; http://thermosciences.stanford.edu/pdf/TSD-115.pdf, 150 pages.

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