Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-12-04
2007-12-04
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S048000, C438S065000, C438S075000
Reexamination Certificate
active
11056484
ABSTRACT:
Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces are disclosed herein. In one embodiment, a method for forming microlenses includes forming a plurality of shaping members on a microfeature workpiece between adjacent pixels, reflowing the shaping members to form a shaping structure between adjacent pixels, depositing lens material onto the workpiece, removing selected portions of the lens material adjacent to the shaping structure such that discrete masses of lens material are located over corresponding pixels, and heating the workpiece to reflow the discrete masses of lens material and form a plurality of microlenses.
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Boettiger Ulrich C.
Li Jin
Lee Hsien-Ming
Micro)n Technology, Inc.
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