Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor
Reexamination Certificate
1999-10-15
2001-06-26
Gorgos, Kathryn (Department: 1741)
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
C205S122000
Reexamination Certificate
active
06251248
ABSTRACT:
BACKGROUND OF THE INVENTION
In order for making microstructures of high aspect ratio, there are many processes, including LIGA, LIGA like, UV photolithography, etc., ever being disclosed for such a purpose. However, such conventional processes are complex and expensive so that they are uneconomic and infeasible on a commercial point of view.
A conventional process for manufacturing high aspect ratio microstructures was disclosed by using a trench-filling etch masking technique by etching deep trenches into a substrate, filling trench filling material in the trenches, and deep etching into the substrate being carried out with the trench-filling material serving as a mask. However, such a prior art requires many process steps for finishing the microstructures, still being time-consuming and lowering production efficiency.
The present inventor has found the drawbacks of the conventional processes, and invented the present microfabrication process more economic and feasible for making microstructures.
SUMMARY OF THE INVENTION
The object of the present invention is to provide a microfabrication process including the steps of:
a. preparing an electrolyte solution to be filled in an electroforming system;
b. forming an electrically insulative masking thin film on a polymer substrate;
c. micromachining the substrate for forming three-dimensional microstructure pattern with deep cavities;
d. shrinking the width or diameter of each cavity of the microstructure pattern by steadily swelling the polymer, which is prefixed on a cathode of the electroforming system, by saturating the electrolyte solution into the polymer;
e. electroforming in the electroforming system electrically connected with an anode and the cathode for filling metal in the cavities in the polymer; and
f. desorption of the electrolyte from the polymer to shrink the polymer to be separated from an electroformed microstructure product, and demolding for obtaining the microstructure product having a high aspect ratio of 100 or even higher.
REFERENCES:
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 3322653 (1967-05-01), Morris
patent: 5098860 (1992-03-01), Chakravorty et al.
patent: 5501784 (1996-03-01), Lessmöllmann et al.
patent: 5770465 (1998-06-01), MacDonald et al.
Gorgos Kathryn
Smith-Hicks Erica
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