Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2008-07-01
2008-07-01
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
Reexamination Certificate
active
07393461
ABSTRACT:
The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.
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Castaldi Steve
Feng Kesheng
Kapadia Nilesh
Carmody & Torrance LLP
Culbert Roberts
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